---
product_id: 659638105
title: "EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology"
brand: "sanyi"
price: "€ 10.77"
currency: EUR
in_stock: false
url: https://www.desertcart.nl/products/659638105-epo-tek-353nd-1-lb-kit-high-temperature-epoxy-resin
store_origin: NL
region: Netherlands
---

# 3-hour pot life for flexible use High-temp cure at 150°C NASA-grade low outgassing seal EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology

**Brand:** sanyi
**Price:** € 10.77
**Availability:** ❌ Out of Stock

## Summary

> 🔥 Seal the future with space-grade epoxy precision!

## Quick Answers

- **What is this?** EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology by sanyi
- **How much does it cost?** € 10.77 with free shipping
- **Is it available?** Currently out of stock
- **Where can I buy it?** [www.desertcart.nl](https://www.desertcart.nl/products/659638105-epo-tek-353nd-1-lb-kit-high-temperature-epoxy-resin)

## Best For

- sanyi enthusiasts

## Why This Product

- Trusted sanyi brand quality
- Free international shipping included
- Worldwide delivery with tracking
- 15-day hassle-free returns

## Key Features

- • **Space-Grade Purity:** Meets NASA ASTM E595 low outgassing standards—ideal for ultra-clean environments.
- • **Extended Work Window:** Up to 3 hours pot life lets you perfect your mix and application without rush.
- • **Robust Mechanical Strength:** Shore D hardness 85 and lap shear strength > 2,000 psi ensure durable, long-lasting bonds.
- • **Precision Thermal Performance:** Cures at 150°C in just 1 hour for rapid, reliable bonding.
- • **Versatile Industry Applications:** From semiconductor wafer bonding to fiber optic sealing and MEMS device assembly.

## Overview

EPO-TEK 353ND is a high-temperature, two-part epoxy resin kit designed for advanced semiconductor, fiber optic, and electronic applications. It cures quickly at 150°C, offers a 3-hour pot life for flexible handling, and meets NASA low outgassing standards, making it perfect for ultra-clean, high-performance bonding and sealing tasks across cutting-edge industries.

## Description

EPO-TEK 353ND Epoxy Resin 1 lb one Kit Set 2 Parts 2 Component Part A 0.91 lb + Part B 0.09 lb  Stir Contents Before Use Recommended Cure: 150°C / 1 Hour Mix Ratio by Weight: 10 : 1  Two component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications.  Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.  Passes NASA low outgassing standard ASTM E595 with proper cure  Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.  Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging. Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions.  Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications: Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range. Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.  Electronics Assembly suggested applications: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices. Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets. Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets.  Specific Gravity: Part A: 1.20 Part B: 1.02 Pot Life: ≤ 3 Hours Color (before cure): Part A: Clear (Gardner <5), Part B: Amber (Gardner <18) Shelf Life: One year at room temperature Viscosity (23°C) @ 50 rpm: 3,000 - 5,000 cPs

## Features

- EPO-TEK 353ND. 1lb Kit. 2 Parts A 0.91 lb + B 0.09 lb. High Temperature Epoxy Resin. Muti Application for Semiconductor, Optic Fiber, Electronic etc.
- Recommended Cure: 150°C / 1 Hour. Mix Ratio by Weight: 10 : 1. Stir Contents Before Use. Pot Life: ≤ 3 Hours (Syringe: ≤ 2 Hours). Specific Gravity: Part A: 1.20 Part B: 1.02. Shelf Life: One year at room temperature. Color (before cure): Part A: Clear, Part B: Amber. Viscosity (23°C) @ 50 rpm: 3,000 - 5,000 cPs.
- Semiconductor. Wafer-Wafer Bonding. MEMs Devices. Flip Chip Underfill. Hybrid Applications. UHV Seals. Fiber Component Packaging. Electronics Assembly. Dielectric Layer. CSP. MEM device.
- High Thermal Stability. Low Outgassing. Electrical Insulation. Versatile Application.
- Thixotropic Index: N/A. Glass Transition Temp: ≥ 90 °C. Coefficient of Thermal Expansion (CTE): Below Tg: 54 x 10⁻⁶ in/in°C. Above Tg: 206 x 10⁻⁶ in/in°C. Shore D Hardness: 85. Lap Shear @ 23°C: > 2,000 psi. Die Shear @ 23°C: ≥ 15 Kg, 5,334 psi. Degradation Temp: 412 °C. Storage Modulus: 508,298 psi. Ion Content: Cl⁻: 329 ppm NH₄⁺: 409 ppm K⁺: 5 ppm. Volume Resistivity @ 23°C: ≥ 1.8 x 10¹³ Ohm-cm. Dielectric Constant (1KHz): 3.17. Dissipation Factor (1KHz): 0.005.

## Technical Specifications

| Specification | Value |
|---------------|-------|
| Brand | SANYI |
| Material | Epoxy Resin |
| Item Form | Liquid |
| Special Feature | Heat Resistant, High Thermal Stability, Low Outgassing, Strong, Versatile Applications |
| Color | Clear, Amber |
| Item Package Quantity | 1 |
| Package Information | Bottle |
| Item Volume | 16 Fluid Ounces |
| Viscosity | 3,000 - 5,000 cPs |
| Full Cure Time | 1 Hours |
| Water Resistance Level | Water Resistant |
| Unit Count | 16.0 Ounce |
| Manufacturer | EPO-TEK |
| Package Dimensions | 9.84 x 7.87 x 5.91 inches |
| Item Weight | 1 pounds |
| ASIN | B0DHX9HZQM |
| Item model number | EPO-TEK 353ND |
| Date First Available | September 25, 2024 |

## Product Details

- **Brand:** SANYI
- **Material:** Epoxy Resin
- **Item Form:** Liquid
- **Special Feature:** Heat Resistant, High Thermal Stability, Low Outgassing, Strong, Versatile Applications
- **Color:** Clear, Amber

## Images

![EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology - Image 1](https://m.media-amazon.com/images/I/71WGp5BtdWL.jpg)
![EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology - Image 2](https://m.media-amazon.com/images/I/71L0hK7TE7L.jpg)
![EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology - Image 3](https://m.media-amazon.com/images/I/71wKxiIDf-L.jpg)
![EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology - Image 4](https://m.media-amazon.com/images/I/71bwlEgAZbL.jpg)
![EPO-TEK 353ND 1 lb Kit High Temperature Epoxy Resin for Semiconductor Optic Fiber Electronic Use Muti Application Two Parts A+B UHV Seal Wafer Bonding MEM Device Epoxy Technology - Image 5](https://m.media-amazon.com/images/I/71vep0e50zL.jpg)

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*Product available on Desertcart Netherlands*
*Store origin: NL*
*Last updated: 2026-02-17*